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RISClosure to “Discussion of â€کMechanical Anisotropy and Strain Rate Dependency Behavior of Ti6Al4V Produced Using E Beam Additive Fabrication’†(Pettit, C., Mullen, J., Bhave, T., and Kraft, F. F., ASME J. Eng. Mater. Technol., 137(3), p. 031006)
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: According to classical mechanics definition, if the material properties are the same in all direction, material is called isotropic. The word isotropy means uniformity in all orientations and it is derived from the Greek ...
Successive Softening and Cyclic Damage in Viscoplastic Material
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A successive initiation finite element modeling approach is presented in which an empirical continuum damage model, energy partitioning damage evolution model, developed by the author is used to ...
Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The elastic and plastic mechanical properties of intermetallic compound (IMC) phases of a leadfree Sn3.5Ag/Cusubstrate soldering system are investigated in different sized joints using nanoindentation. The specimens were ...
Transition of Crack Propagation Path Under Varied Levels of Load in Bimodal Grain Size Al-Mg Alloy
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Mechanical fatigue crack nucleation and propagation is modeled in bimodal grain size aluminum alloy. A multiscale modeling approach in conjunction with a continuum based damage modeling technique, ...
Damage Initiation and Propagation in Voided Joints: Modeling and Experiment
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This study examines damage initiation and propagation in solder joints with voids, under thermomechanical cyclic loading. An accelerated thermal cycling test is conducted on printed wiring assemblies ...
Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Currently, intermetallics (IMCs) in the solder joint are getting much attention due to their higher volume fraction in the smaller thickness interconnects. They possess different mechanical properties compared to bulk ...
Effect of Voids on Thermomechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The effect of process-induced voids on the durability of Sn–Pb and Pb-free solder interconnects in electronic products is not clearly understood. Experimental studies have provided conflicting ...
Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid Liquid Interdiffusion Sn3.5Ag/Cu Substrate Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The effect of joint size on the interfacial reaction in the Sn3.5Ag/Cusubstrate soldering system was examined. An experiment was conducted in which parameters such as bonding time, temperature, and pressure were varied at ...
Mechanical Anisotropy and Strain Rate Dependency Behavior of Ti6Al4V Produced Using E Beam Additive Fabrication
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Anisotropic mechanical behavior is an inherent characteristic of parts produced using additive manufacturing (AM) techniques in which parts are built layer by layer. It is expected that inplane and outofplane properties ...
Fatigue Life of Piles in Integral-Abutment Bridges: Case Study
Publisher: American Society of Civil Engineers
Abstract: Piles in integral-abutment bridges (IABs) may experience plastic deformation and low cycle fatigue as a result of cyclic loading induced by daily and seasonal temperature variations. This paper presents guidelines that ...