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    Solder Joint Creep and Stress Relaxation Dependence on Construction and Environmental-Stress Parameters 

    Source: Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 002:;page 165
    Author(s): R. G. Ross; L. C. Wen; G. R. Mon
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Creep strain is probably the most important time-dependent damage accrual factor affecting solder joint reliability. Under typical multi-hour loading conditions, creep-induced strain is a complex ...
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    Solder Creep-Fatigue Interactions With Flexible Leaded Parts 

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 002:;page 185
    Author(s): R. G. Ross; L. C. Wen; G. R. Mon; E. Jetter
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: With flexible leaded parts, the solder-joint failure process involves a complex interplay of creep and fatigue mechanisms. To better understand the role of creep in typical multi-hour cyclic ...
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