Search
CSV
RISHigh-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire-Polydimethylsiloxane Composite Thermal Interface Materials Tape
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Abstract. Thermal interface materials (TIMs) play a crucial role in thermal management in modern electronics, where minimizing overall thermal resistance is critical for reliable and efficient operation. Among various ...
Thermal Management of Three-Dimensional Chips and Monolithic Integrated Circuits Using Phase Change Materials–Si/Cu Composites
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Abstract. The increasing demand for high-performance computing has accelerated the development of three-dimensional integrated circuits (3DICs), which offer enhanced performance but pose significant thermal challenges due ...
Feasibility Study of Implementing a Hybrid Single- and Two-Phase Cooler for High Power Density Power Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Abstract. Thermal management is crucial in power module design nowadays, significantly influencing the cost, performance, and reliability of the traction inverters. As we strive for greater power density and smaller form ...
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm2) Power Electronics Cooling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal management of power electronics modules is one of the limiting factors in the peak power capability of the traction inverter system and overall efficiency of the e-drive. Liquid cooling using embedded microchannels ...