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    Additively Printed Circuit Performance of Thermoformed In-Mold Electronics for Automotive Applications 

    Source: Journal of Electronic Packaging:;2026:;volume( 148 ):;issue:003:;page 1
    Author(s): Lall, Pradeep; Harsha, Aditya; Kulkarni, Shriram; Miller, Scott
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Abstract. The use of in-mold Electronics has the potential for transforming design and production of automotive systems through greater integration of form and function and lightweighting achieved by elimination of wire ...
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    Comparative Performance Analysis of Screen-Printed Structures on Polyethylene Terephthalate and BPET Substrates Utilizing Low-Temperature Electrically Conductive Adhesive and MACA for Surface Mount Device Component Attachment 

    Source: Journal of Electronic Packaging:;2026:;volume( 148 ):;issue:003
    Author(s): Lall, Pradeep; Kulkarni, Shriram; Miller, Scott
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Abstract. Polyethylene terephthalate (PET) and polymide (PI) are used for the additive fabrication of flexible hybrid electronics (FHE) due to their excellent thermal and dimensional stability and mechanical strength. ...
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