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    Prediction of Electromigration Critical Current Density in Passivated Arbitrary-Configuration Interconnect 

    Source: Journal of Electronic Packaging:;2019:;volume( 141 ):;issue: 002:;page 21008
    Author(s): Kimura, Yasuhiro; Saka, Masumi
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A critical current density, a criterion of electromigration (EM) resistance in interconnects, above which EM damages initiate has been studied to minimize EM damages of interconnects. In general, the assessment of a critical ...
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    Prediction of Electromigration Critical Current Density in Passivated Arbitrary-Configuration Interconnect 

    Source: Journal of Electronic Packaging:;2019:;volume( 141 ):;issue: 002:;page 21008
    Author(s): Kimura, Yasuhiro; Saka, Masumi
    Publisher: American Society of Mechanical Engineers (ASME)
    Abstract: A critical current density, a criterion of electromigration (EM) resistance in interconnects, above which EM damages initiate has been studied to minimize EM damages of interconnects. In general, the assessment of a critical ...
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    High Temperature Tensile and Compressive Behaviors of Nanostructured Polycrystalline AlCoCrFeNi High Entropy Alloy: A Molecular Dynamics Study 

    Source: Journal of Engineering Materials and Technology:;2023:;volume( 146 ):;issue: 002:;page 21003-1
    Author(s): Yoon, Sungmin; Kimura, Yasuhiro; Uchida, Motoki; Ju, Yang; Toku, Yuhki
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Molecular dynamics studies were performed to assess tensile and compressive behaviors at high temperatures up to 1200 °C for nanostructured polycrystalline AlCoCrFeNi high entropy alloy (HEA). As the temperature increased, ...
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