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Few-Shot Classification of Wafer Bin Maps Using Transfer Learning and Ensemble Learning
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The high cost of collecting and annotating wafer bin maps (WBMs) necessitates few-shot WBM classification, i.e., classifying WBM defect patterns using a limited number of WBMs. Existing few-shot WBM classification algorithms ...
Classification of Chip-Level Defect Types in Wafer Bin Maps Using Only Wafer-Level Labels
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Defective chips in wafer bin maps (WBMs) form different spatial patterns depending on the root causes of process failures. Therefore, the identification of defect patterns in WBMs can help practitioners identify the root ...
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