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RISInfluence of Boundary Conditions and Component Placement on Lifetime of Printed Circuit Board Assemblies Under Vibration Loading: XGBoost and Stochastic Gradient Boosting Analysis With SHAP Interpretation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Abstract. Ensuring the vibration reliability of electronic packages is crucial for their long-term operation, especially in high-reliability environments. The research investigates the effects of boundary conditions, ...