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    Reducing Warpage of Printed Circuit Boards by Using Wavy Traces 

    Source: Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 003:;page 282
    Author(s): Parsaoran Hutapea; Joachim L. Grenestedt
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Printed circuit boards (PCB’s) often warp when subjected to temperature changes, associated with either the manufacturing process or the usage. In order to reduce the warpage, waviness was ...
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    Elastic-Plastic Wrinkling of Sandwich Panels With Layered Cores 

    Source: Journal of Applied Mechanics:;2005:;volume( 072 ):;issue: 002:;page 276
    Author(s): Joachim L. Grenestedt; Mikael Danielsson
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Elastic-plastic wrinkling of compression loaded sandwich panels made with layered cores was studied analytically and experimentally. A core with a stiff layer near the sandwich skins can improve ...
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