Search
Now showing items 1-2 of 2
Reducing Warpage of Printed Circuit Boards by Using Wavy Traces
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Printed circuit boards (PCB’s) often warp when subjected to temperature changes, associated with either the manufacturing process or the usage. In order to reduce the warpage, waviness was ...
Elastic-Plastic Wrinkling of Sandwich Panels With Layered Cores
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Elastic-plastic wrinkling of compression loaded sandwich panels made with layered cores was studied analytically and experimentally. A core with a stiff layer near the sandwich skins can improve ...
CSV
RIS