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Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Polymeric encapsulant is widely used to protect the integrated circuit chips and thus to enhance the reliability of electronic packages. Residual stresses are introduced in the plastic package ...
Use of Polymer/Organoclay Nanocomposite Surface Treatment as Water/Ion Barrier for Concrete
Publisher: American Society of Civil Engineers
Abstract: The durability of concrete structures is strongly affected by the ease of water and ion penetration. Polymeric surface treatment with epoxy and silane are commonly used to provide a barrier to the ingress of water and ions. ...
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