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RISAnalytical Solution for the Thermopiezoelastic Behavior of a Smart Functionally Graded Material Hollow Sphere Under Radially Symmetric Loadings
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An analytical study of the piezothermoelastic behavior of a functionally graded material (FGM) hollow sphere with integrated piezoelectric layers as a sensor and actuator under the effect of radially symmetric thermoelec ...
Time Dependent Electro–Magneto–Thermoelastic Stresses of a Poro Piezo Functionally Graded Material Hollow Sphere
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, analytical solution for timedependent electro–magneto–thermoelastic stresses of a hollow sphere made of a fluidsaturated functionally graded porous piezoelectric material (FGPPM) is presented. All material ...
Mechanical and Thermal Stresses in FGPPM Hollow Cylinder Due to Radially Symmetric Loads
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, the general solution of steadystate 1D radially symmetric mechanical and thermal stresses and electrical and mechanical displacements for a hollow thick cylinder made of fluidsaturated functionally graded ...
General Solution for Mechanical and Thermal Stresses in a Functionally Graded Hollow Cylinder due to Nonaxisymmetric Steady-State Loads
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, the general theoretical analysis of two-dimensional steady-state thermal stresses for a hollow thick cylinder made of functionally graded material is developed. The temperature distribution is assumed to be ...
Solution for Equation of Two-Dimensional Transient Heat Conduction in Functionally Graded Material Hollow Sphere With Piezoelectric Internal and External Layers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, an exact solution for the equation of two-dimensional transient heat conduction in a hollow sphere made of functionally graded material (FGM) and piezoelectric layers is developed. Transient temperature ...
Modeling of Moisture Transport Into an Electronic Enclosure Using the Resistor-Capacitor Approach
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The aim of this paper is to model moisture ingress into a closed electronic enclosure under isothermal and non-isothermal conditions. As a consequence, an in-house code for moisture transport is developed using the ...