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RISAn Experimental Investigation of Deformation of Plated Holes for a Single 30-210-30°C Thermal Cycle
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The out-of-plane displacement field around two plated holes with different pad diameters in an FR-4 printed wiring board was measured for a single 30°C–210°C–30°C temperature cycle ...