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RISAssembly of Heterogeneous Materials for Biology and Electronics: From Bio-Inspiration to Bio-Integration
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Specific function or application in electronics often requires assembly of heterogeneous materials in a single system. Schemes to achieve such goals are of critical importance for applications ranging from the study in ...
Mechanics of Interfacial Delamination in Epidermal Electronics Systems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In order to provide continuous diagnostic and therapeutic options that exploit electrophysiological signals from the epidermis, this study discusses epidermal electronics systems (EES) that conform to the skin surface via ...
A Simply Analytic Study of Buckled Thin Films on Compliant Substrates
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Buckling of stiff thin films on compliant substrates enables many new applications, such as stretchable electronics. Song et al. [2008, “Buckling of a Stiff Thin Film on a Compliant Substrate in Large Deformation,†...
Mechanics of Solar Module on Structured Substrates
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In the islandinterconnect design, the device islands connected by interconnects are mounted on a soft elastomeric substrate. The outofplane motion of interconnects accommodates the deformation applied to the system, enabling ...
Understanding Factors Influencing Project Managers’ Behavioral Intentions to Reduce Waste in Construction Projects
Publisher: American Society of Civil Engineers
Abstract: Although investigating project stakeholders’ waste reduction intentions and behaviors has gained increasing attention in construction projects, limited efforts have been devoted to understanding behavioral intentions of ...
Design of the Magnetic Stamp Film for Electromagnetic-Assisted Transfer Printing
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As a critical step to integrate micro-nano electronic components on the soft substrate, transfer printing allows the facile fabrication of flexible electronics. The key to a successful transfer printing process is to ...
Performance of Modified Electro-Fenton Process for Phenol Degradation Using Bipolar Graphite Electrodes and Activated Carbon
Publisher: American Society of Civil Engineers
Abstract: A modified version of the electro-Fenton process was evaluated for the degradation of phenol in an aqueous solution with bipolar graphite electrodes and activated carbon. The effects on reaction parameters including the ...
Robust Design Optimization of Component Parameters for DMDEB Powertrain System Based on Taguchi Method
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The selection of component parameters plays an important role in the energy optimization of dual-motor drive electric buses (DMDEBs). To design a set of parameters that can be robust to different road slopes, passenger ...
Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this work, we develop and evaluate algorithms for generating ultrapacked microstructures of particles. Simulated microstructures reported in the literature rarely contain particle volume fractions greater than 60%. ...
Automated Part Placement for Precast Concrete Component Manufacturing: An Intelligent Robotic System Using Target Detection and Path Planning
Publisher: American Society of Civil Engineers
Abstract: Placing embedded parts (EPs), e.g., junction boxes or plastic cable ducts, in a precast concrete (PC) component is a fundamental and repetitive trade in its manufacturing. Yet, such trade is far from being automated ...