Abstract: In the present paper, surface Green functions in an anisotropic elastic half-domain subjected to a concentrated force and a line force are derived using Stroh’s formalism considering surface ...

Abstract: Portable electric devices such as mobile phones and portable music players have become compact and improved their performance. High-density packaging technology such as chip size package (CSP) ...

Abstract: This paper treats an instability at the free surface of non-Newtonian (power-law) fluid films between two tilted plates in a negative squeeze motion. The meniscus instability in a fluid with ...

Abstract: In the present paper, a deformation induced in a new bonding technology of chip-scale package (CSP) using resin encapsulation sheets is examined numerically and experimentally. Deflections after ...

Abstract: The plane problem of three-phase materials consisting of three isotropic homogeneous wedges with arbitrary angles, which are with two interfaces and two free surfaces, is analyzed under arbitrary ...