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Managing Digital Integration Routines in Engineering Firms: Cases of Disruptive BIM Cloud Collaboration Protocols
Publisher: ASCE
Abstract: The challenge for engineering firms to align with an unprecedented variation of digital integration agendas across projects is a recent phenomenon. The literature has offered only a partial understanding of this challenge ...
Mixing in Thermals with and without Buoyancy Reversal
Publisher: American Meteorological Society
Abstract: The mixing characteristics of turbulent thermals were investigated in a water tank via laser-induced fluorescence techniques. The concentration of mixed fluid in the far field of a ?classical? thermal is approximately ...
Effect of Internal Moment Release on the Eigenfrequencies of Combined Linear Systems
Publisher: American Society of Civil Engineers
Abstract: A method for analyzing the free vibration of complex structural systems, consisting of a simple oscillator attached to a beam with an internal hinge, is presented. A mathematical model possessing important features of ...
Main Cause of Deterioration in Wet–Dry Test Method on Base Course Material
Publisher: ASCE
Abstract: The wet–dry cycles test examines the durability of stabilized soils. The deterioration process in this test can be attributed to multiple factors, so this attempt aims to explore the most important one. Uniaxial compression ...
A Multidisciplinary Design and Optimization Methodology for Ball Grid Array Packages Using Artificial Neural Networks
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A systematic multidisciplinary electronics packaging design and optimization methodology, which takes into account the complexity of multiple design trade-offs, operated in conjunction with the ...
Thermal Modeling Technique for Multiple Transistors Within Silicon Chip
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Although thermal performance is always a critical issue in electronic packaging design at every packaging level, there is a significant lack of reliable and efficient thermal modeling and analysis ...
Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A multidisciplinary placement optimization methodology for heat generating electronic components on printed circuit boards (PCBs) is presented. The methodology includes thermal, electrical, and ...
Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Electronics packaging design is a process that requires optimized solutions based on multidisciplinary design trade-offs, which usually have complex relationships among multiple design variables. ...
Seismic Collapse Risk Assessment and FRP Retrofitting of RC Coupled C-Shaped Core Walls Using the FEMA P695 Methodology
Publisher: American Society of Civil Engineers
Numerical Simulation of Turbulent Pipe Flow for Water Hammer
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A numerical model of turbulent transient flow is used to study the dynamics of turbulence during different periods of water hammer in a polymeric pipe. The governing equations of the transient flow are solved by using the ...
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