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RISReliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A novel reliability evaluation procedure of lead-free solders used in electronic packaging (EP) subjected to thermomechanical loading is proposed. A solder ball is represented by finite elements (FEs). Major sources of ...
An Improved Reliability Analysis Method for Mooring Dolphin Structures
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A novel reliability evaluation procedure is proposed for analysis and design of offshore mooring dolphin structures (MDS). It is a hybrid approach consisting of an improved response surface method (IRSM), secondorder ...
Reliability Analysis of Piles in Multilayer Soil in Mooring Dolphin Structures
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Reliability of complicated mooring dolphin structures (MDS) is estimated using few deterministic evaluations and an improved response surface method denoted as IRSMsecondorder reliability method (SORM). It is a hybrid ...