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    Stress Analysis Applications to Service Failures of Traveling-Wave Tubes 

    Source: Journal of Vibration and Acoustics:;1984:;volume( 106 ):;issue: 004:;page 533
    Author(s): H.-Y. Yeh
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: By utilizing the mathematical analogy between the electrostatic fields and the elastic stress field, the electrostatic stresses in high voltage electronic device such as Traveling Wave Tubes (TWT) ...
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    Validation of Electronic Package Reliability Using Speckle Interferometry 

    Source: Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 003:;page 277
    Author(s): H.-Y. Yeh; K. Cote
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In-situ measurements were performed on organic based substrates under mechanical loading as well as land grid array electronic packages under thermal cycling. Whole field displacement measurements ...
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    Effect of Transverse Moduli on Through-Thickness Hygrothermal Expansion Coefficients of Composite Laminates 

    Source: Journal of Applied Mechanics:;2001:;volume( 068 ):;issue: 006:;page 878
    Author(s): H.-L. Yeh; H.-Y. Yeh
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In practical analysis, under a plane stress condition, a unidirectional lamina can be assumed with E2=E3 from geometrical symmetry consideration. However, from an academic point of view, it is ...
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    Robust Control for Structural Systems with Unstructured Uncertainties 

    Source: Journal of Engineering Mechanics:;2004:;Volume ( 130 ):;issue: 003
    Author(s): Sheng-Guo Wang; Paul N. Roschke; H. Y. Yeh
    Publisher: American Society of Civil Engineers
    Abstract: Natural hazards, such as earthquakes and strong wind events, place large forces on tall, slender structures and on long-span bridges. In view of the numerous uncertainties due to model errors, stress calculations, material ...
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