Abstract: An elasto-plastic analysis of the thermal stresses and strains in a surface mounted plastic-quad-flat-pack (PQFP) assembly by using a 3-D finite element method is presented in this paper. Detailed ...

Abstract: The purpose of this paper is to point out a very common mistake made in determining the thermal stresses in composite structures by finite element methods. Furthermore, a simple technique to ...

Abstract: Sneddon and Lockett obtained a fairly general solution to the steady-state thermoelastic problem for the thick plate (Sneddon and Lockett, 1960). In particular, they have obtained the exact ...

Abstract: An exact analysis is presented for the creep deformation of a thin-walled circular solder cylinder under the actions of bending and twisting moments. Dimensionless interaction curves and charts ...

Abstract: An approximated closed-form integrated circuit (IC) yield formula based on a Gaussian defect density distribution for the compounder in Murphy’s yield integral is presented. Also, a closed-form ...

Abstract: The ductility of a copper film has been determined by an elastoplastic large deflection finite element method. The effective stress and incremental plastic strain and pressure-deflection curves ...

Abstract: Reliability of the restriction of the use of certain hazardous substances in electrical and electronic equipment compliant products is investigated in this study. Emphasis is placed on the ...