Abstract: This paper reviews recent progress in the development of silicon-based vapor chambers for heat spreading in electronic packages. Effective hotspot mitigation is an increasingly challenging issue in electronics thermal ...

Abstract: Silicononinsulator (SOI) technology has sparked advances in semiconductor and MEMs manufacturing and revolutionized our ability to study phonon transport phenomena by providing singlecrystal silicon layers with thickness ...

Abstract: High performance and economically viable cooling solutions must be developed to reduce weight and volume, allowing for a wide-spread utilization of hybrid electric vehicles. The traditional embedded microchannel cooling ...

Abstract: Laser machining is an inexpensive and fast alternative to conventional microfabrication techniques and has the capability to produce complicated three-dimensional (3D), hierarchical structures. It is especially important ...

Abstract: Silicon-based embedded microchannel with three-dimensional (3D) manifold (MF) μ-cooler offers lower pressure drop and increased heat removal capability (>1 kW/cm2) for microprocessors and power electronics cooling using ...

Abstract: Abstract. Thermal interface materials (TIMs) play a crucial role in thermal management in modern electronics, where minimizing overall thermal resistance is critical for reliable and efficient operation. Among various ...

Abstract: Abstract. The increasing demand for high-performance computing has accelerated the development of three-dimensional integrated circuits (3DICs), which offer enhanced performance but pose significant thermal challenges due ...

Abstract: Gallium nitride (GaN) highelectronmobility transistors (HEMTs) dissipate high power densities which generate hotspots and cause thermomechanical problems. Here, we propose and simulate GaNbased HEMT technologies that can ...

Abstract: The highly nonuniform transient power densities in modern semiconductor devices present difficult performance and reliability challenges for circuit components, multiple levels of interconnections and packaging, and adversely ...

Abstract: Silicon films of submicrometer thickness play a central role in many advanced technologies for computation and energy conversion. Numerous thermal conductivity data for silicon films are available in the literature, but ...