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RISReliability Assessment and Activation Energy Study of Au and Pd Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Wearout reliability and high temperature storage life (HTSL) activation energy of Au and Pdcoated Cu (PdCu) ball bonds are useful technical information for Cu wire deployment in nanoscale semiconductor device packaging. ...