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RISApplications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Heterogeneous integration of electronics is critical to the next wave of electronics applications ranging from extremely power dense energy conversion systems to advanced chiplet and copackaged optics architectures for ...
Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Heterogeneous integration of electronics is critical to the next wave of electronics applications ranging from extremely power dense energy conversion systems to advanced chiplet and copackaged optics architectures for ...