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RISCharacterization of Lead-Free Solders in Flip Chip Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The creep and crack propagation behavior of SnAg3.5, SnAg4Cu0.5, and SnPb37 (as reference) was investigated on flip chip solder joints (V=1×10−12 m3). The test specimen consisted of two ...
The Effect of Underfill and Underfill Delamination on the Thermal Stress in Flip-Chip Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The stresses occurring in the solder joints during thermal loads have been studied by finite element analysis. Besides the cases of no underfill and perfect adhesion, underfill delaminations at ...