Abstract: In certain assemblies there exists a requirement for the evenness of the gap between a “peg” and a “hole.” In these cases, when given a “peg” and a “hole” that must be fitted the task is ...

Abstract: Environmental legislation urges manufacturers to develop effective technologies to cope with obsolete products. The goal is to optimize the disassembly procedure (cost, efficiency) with emphasis ...

Abstract: An investigation of the flip-chip bonding process for application in MEMS devices was carried out. Finite element analyses of axisymmetric and non-axisymmetric solder joint geometries were performed. ...