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RISCohesive Zone Modeling of the Polyimide/Silicon Interface in 2.5D Packaging by Nanoindentation Testing
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Abstract. The polyimide (PI)/silicon (Si) is a critical interface in 2.5D packaging and is highly susceptible to failure due to thermal and mechanical loads. The large thermal expansion mismatch that exists between these ...
Thermal Electromagnetic Co-Design of a MultiChip Radio Frequency Front-End System-in-Package With Embedded Microchannel Cooling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Abstract. As integration density and performance demands continue to rise in modern radio frequency (RF) systems, system-in-package (SiP) architectures face growing challenges in managing both electromagnetic interference ...