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RISNonlinear System Identification Technique for a Base-Excited Structure Based on Modal Space Formulation
Publisher: The American Society of Mechanical Engineers (ASME)
Investigating the Impact of Dynamic Excitation and Boundary Conditions on the Fatigue Life of Board-Level Electronic Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Abstract. Electronic packages are transitioning from cloud computing (controlled environment) to edge computing (uncontrolled environment), presenting new challenges, especially in high-vibration environments like ...
A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The fatigue life prediction of the electronic packages under dynamic loading conditions is an increasingly important area of research, with direct application in packaging industries. Current life prediction methodologies ...