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    Effects of Channel Height and Planar Spacing on Air Cooling of Electronic Components 

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 004:;page 420
    Author(s): David Copeland
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A series of experiments was performed to study forced convection from rectangular arrays of electronic components. Effects of channel height, planar spacing, component row number, and approach ...
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    Single-Phase and Boiling Cooling of Small Pin Fin Arrays by Multiple Nozzle Jet Impingement 

    Source: Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 001:;page 21
    Author(s): David Copeland
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Experimental measurements of multiple nozzle submerged jet array impingement single-phase and boiling heat transfer were made using FC-72 and 1 cm square copper pin fin arrays, having equal width ...
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