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Effects of Channel Height and Planar Spacing on Air Cooling of Electronic Components
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A series of experiments was performed to study forced convection from rectangular arrays of electronic components. Effects of channel height, planar spacing, component row number, and approach ...
Single-Phase and Boiling Cooling of Small Pin Fin Arrays by Multiple Nozzle Jet Impingement
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Experimental measurements of multiple nozzle submerged jet array impingement single-phase and boiling heat transfer were made using FC-72 and 1 cm square copper pin fin arrays, having equal width ...
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