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RISUncertainty Quantification for Compressible Micro-Interconnects in Replaceable Integrated Chiplet Assembly Under Hypergravity
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Abstract. The compressible micro-interconnects (CMIs) in replaceable integrated chiplet (PINCH) assemblies enable reusable integration in high-performance electronic devices. However, CMIs are sensitive to gravitational ...
A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Ball grid arrays (BGAs) offer significant advantages in the automotive industry, such as their small size and high integration density, making them a promising electronic packaging approach. However, the operating environment ...