Search
CSV
RISEffect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Currently, intermetallics (IMCs) in the solder joint are getting much attention due to their higher volume fraction in the smaller thickness interconnects. They possess different mechanical properties compared to bulk ...