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RISPropensity for Pad Cratering Evaluation in Board Resin and Board-Resin/Glass Interface Under Assembly and Rework
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Abstract. Pad cratering is a major concern in high I/O ball grid array packaging architectures. Assessment of propensity for pad cratering is presently beyond the state of art. Failure in pad cratering is manifested through ...
Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Flexible devices, which are seen as the future of the electronics industry, require encapsulation for protection while meeting the flexibility requirements of end applications. Flexible electronics have lower production ...