Abstract: Abstract. In this article, the thermodynamic configurational force and velocity associated with a reaction-diffusion moving interface are studied to derive both the Cauchy stress, its Eshelbian form, and their Piola ...

Abstract: Studies have reported that the electromigration-induced void growth velocity in metal thin films is inversely related to the adhesion strength of the metal thin film with the base and passivation layers. It was also observed ...