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RISPublisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation” (Cheng, H. C., and Liu, Y. C., 2023, ASME J. Electron. Packag.,145(2), p. 021005)
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An error occurred in the school affiliation address of the authors. Taichung, Taiwan 407, China is incorrect. It should be Taichung, Taiwan 407.
Thermo-Mechanical Simulation Framework for Assessing Process-Induced Delamination Risks in Large-Area Fan-Out Panel-Level Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Abstract. This study develops a finite element modeling (FEM) framework for predicting interfacial fracture behavior during the debonding stage of fan-out panel-level packaging (FOPLP). Although FOPLP offers advantages ...
Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this work, the elastic–plastic properties of the printed interconnects on a glass substrate with Ag-filled polymer-conductor ink are evaluated through a theoretical framework based on finite element (FE) modeling of ...