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Elastic Analysis of Flip-Chip Solder Joints Undergoing Thermal Excursions
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An elastic analysis is developed to provide estimates of the stresses in area array solder joints during thermal excursions. The analysis provides a rapid quantitative evaluation of the important ...
The Effect of Underfill and Underfill Delamination on the Thermal Stress in Flip-Chip Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The stresses occurring in the solder joints during thermal loads have been studied by finite element analysis. Besides the cases of no underfill and perfect adhesion, underfill delaminations at ...
Bilevel Optimization for Integrated Shelter Location Analysis and Transportation Planning for Hurricane Events
Publisher: American Society of Civil Engineers
Abstract: Responding to hurricanes is an exceedingly complex task, the effectiveness of which can significantly influence the final effects of a hurricane. Despite a lot of progress, recent events and unchecked population growth in ...
Structure of a Horizontal Sediment-Laden Momentum Jet
Publisher: American Society of Civil Engineers
Abstract: Partially treated wastewater discharge from marine outfall diffusers often contains inorganic and organic solids that may settle close to the source and give rise to sludge banks that affect benthic ecology. An experimental ...
Approximate Solution Procedure for Dynamic Traffic Assignment
Publisher: American Society of Civil Engineers
Abstract: This paper proposes an approximate dynamic traffic assignment algorithm for the analysis of traffic conditions in large-scale road networks over several days. The time-dependent origin-destination trips are assumed to be ...
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