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    Mechanical Engineering Issues and Electronic Equipment Reliability: Incurred Costs Without Compensating Benefits 

    Source: Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 001:;page 1
    Author(s): C. T. Leonard
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Temperature is widely viewed as a major influence on failures of electronic equipment. Failure Prediction Methodology (FPM), such as MIL-HDBK-217 is an often quoted reference describing the ...
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