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    Study on Failure Mechanism of PCT Reliability for BT Substrate Based CSP (Chip Scale Package) 

    Source: Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 004:;page 334
    Author(s): C. L. Chung; James Fan; M. L. Huang; F. J. Tsai
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this paper, the study on failure mechanism of moisture sensitivity reliability is reported. It focuses on the PCT conditions which are 121°C, 2atm, 100RH%, and 168 hr. The general ...
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