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RISReliability Analysis of a Microinverter Prototype: A Case Study on Sn-Ag-Cu Solder Under Thermal Fatigue for Encapsulated GaN Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Abstract. A single-stage dual-active-bridge direct current-alternating current (DC-AC) micro-inverter prototype with Gallium Nitride (GaN) primary switching devices was assembled and subjected to environmental reliability ...