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Predicted Thermal Stresses in a Trimaterial Assembly With Application to Silicon Based Photovoltaic Module
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Lowtemperature thermally induced stresses in a trimaterial assembly subjected to the change in temperature are predicted based on an approximate structural analysis (strengthofmaterials) analytical (“mathematicalâ€) ...
Predicted Size of an Inelastic Zone in a Ball Grid Array Assembly
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A simple and easytouse analytical (“mathematicalâ€) predictive model has been developed for the assessment of the size of an inelastic zone, if any, in a ballgridarray (BGA) assembly. The BGA material is considered ...
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