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    Analytical Thermal Solution to a Nonuniformly Powered Stack Package With Contact Resistance 

    Source: Journal of Heat Transfer:;2013:;volume( 135 ):;issue: 011:;page 111015
    Author(s): Ghalambor, S.; Agonafer, D.; Haji
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The semiconductor industry, following Moore's law, has consistently followed a trajectory of miniaturization that enables design engineers to achieve greater levels of innovation in the same or smaller die footprints. ...
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    DSpace software copyright © 2002-2015  DuraSpace
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