Search
CSV
RISEffect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid Liquid Interdiffusion Sn3.5Ag/Cu Substrate Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The effect of joint size on the interfacial reaction in the Sn3.5Ag/Cusubstrate soldering system was examined. An experiment was conducted in which parameters such as bonding time, temperature, and pressure were varied at ...