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RISStructural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The elastic and plastic mechanical properties of intermetallic compound (IMC) phases of a leadfree Sn3.5Ag/Cusubstrate soldering system are investigated in different sized joints using nanoindentation. The specimens were ...
Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid Liquid Interdiffusion Sn3.5Ag/Cu Substrate Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The effect of joint size on the interfacial reaction in the Sn3.5Ag/Cusubstrate soldering system was examined. An experiment was conducted in which parameters such as bonding time, temperature, and pressure were varied at ...