Abstract: This study analyzed the reliability of two condition types of copper leadframe, namely, good and oxidized. Both types of leadframe were used in the fabricating process of a quad flat no-lead ...

Abstract: Phenolic and amine epoxy systems are widely used as hardeners in underfill materials for flip chip packaging. A comparison was made between these two systems in order to evaluate the reliability ...

Abstract: This paper reports the effects of a multiple zincation process on the Al bond pad surface prior to electroless nickel immersion gold deposition. The study of multiple zincation comprises the ...

Abstract: Relatively little information is available on the growth patterns of gold aluminide compound in accurate 3D measurement as compared with 2D images of the projected surface. A 3D surface imaging ...