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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
Thermomechanical Modeling of Direct Chip Interconnection Assembly
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Efforts to model thermomechanical aspects of the Direct Chip Interconnection (DCI) assembly process are described. DCI is a method to simultaneously attach and electrically interconnect bare chips ...
Analysis of Bending and Shearing of Tri-Layer Laminations for Solder Joint Reliability
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: For solder joint reliability reasons, direct chip attach technology uses an underfill material to restrict the movement of the silicon die relative to the substrate due to differences in their ...
Analysis and Modeling of Lead Coplanarity Distributions
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Lead coplanarity is defined as the height of a packaged device lead above the seating plane on which the device rests. The yield of a mass reflow surface mount soldering assembly process ...