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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Thermo Fluid Stress Deformation Analysis of Two Layer Microchannels for Cooling Chips With Hot Spots
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Twolayer single phase flow microchannels were studied for cooling of electronic chips with a hot spot. A chip with 2.45 أ— 2.45 mm footprint and a hot spot of 0.5 أ— 0.5 mm in its center was studied in this research. ...