Search
Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-1 of 1
Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: When two thin plates or layers are bonded together, an extremely thin bond layer of third material exists between the two layers. This research work examines the effect of bond layer on the ...