Search
Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-6 of 6
Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Presently, stack dice are used widely as low-power memory applications because thermal management of 3D architecture such as high-power processors inherits many thermal challenges. Inadequate thermal ...
Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Integration of different functional components such as level two (L2) cache memory, high-speed I/O interfaces, and memory controller has enhanced microprocessor performance. In this architecture, ...
Thermoelectric Cooling Analysis Using Modified-Graphical-Method for Multidimensional-Heat-Transfer-System
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Comprehensive analysis of microelectronic cooling systems utilizing thermoelectric modules is time consuming because it involves solving many parametric equations, which require solving complex ...
Design Optimization and Reliability of PWB Level Electronic Package
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As the electronic packaging industry develops technologies for fabrication of smaller, faster, economical and reliable products, thermal management and design play an important role. Temperature ...
Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In a typical raised floor data center with alternating hot and cold aisles, air enters the front of each rack over the entire height of the rack. Since the heat loads of data processing ...
Development of Analytical Model to a Temperature Distribution of a First Level Package With a Nonuniformly Powered Die
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Microprocessors continue to grow in capabilities, complexity, and performance. Microprocessors typically integrate functional components such as logic and level two cache memory in their architecture. ...