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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
Thermally Aware, Energy Based Load Placement in Open Aisle, Air Cooled Data Centers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper introduces a methodology for developing a reduced order model, using proper orthogonal decomposition (POD), to predict the IT rack's inlet temperature distribution within a raised floor aircooled data center. ...
Expanded Assessment of a Practical Thermally Aware Energy Optimized Load Placement Strategy for Open Aisle, Air Cooled Data Centers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper expands on the work presented by Demetriou and Khalifa (Demetriou and Khalifa, 2013, “Thermally Aware, EnergyBased Load Placement in OpenAisle, AirCooled Data Centers,†ASME J. Electron. Packag., 135(3), p. ...
A Holistic Evaluation of Data Center Water Cooling Total Cost of Ownership
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The generationtogeneration information technology (IT) performance and density demands continue to drive innovation in data center cooling technologies. For many applications, the ability to efficiently deliver cooling via ...