Search
Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-1 of 1
Three-Dimensional CFD Model of Pressure Drop in µTAS Devices in a Microchannel
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Microposts are utilized to enhance heat transfer, adsorption/desorption, and surface chemical reactions. In a previous study [Yeom et al. , J. Micromech. Microeng., 19, p. 065025 (2009)], based ...