Search
Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-1 of 1
Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive Loads
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Solder joints in electronic assemblies experience damage due to cyclic thermomechanical loading that eventually leads to fatigue fracture and electrical failure. While solder joints in smaller, die-sized area-array packages ...