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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: With the development of packaging devices toward high performance and high density, electronic devices are subjected to thermo-electric stresses under service conditions, which has become a particularly important reliability ...