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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Effect of Load-Mix on Fatigue Crack Growth in 63Sn-37Pb Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Fatigue crack growth at the interface between Sn-Pb solder and Cu was examined under various mixed-mode conditions. The load-mix, in terms of the ratio of Mode-II to Mode-I stress intensities, ...