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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Observations on the Mechanisms of Fatigue in Eutectic Pb-Sn Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Near-eutectic Pb-Sn solders are widely used for joints in electrical devices. These are liable to failure by thermal fatigue during operation of the device. Since the thermal fatigue load is ...