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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Reliability of electronic assemblies at board level and solder joint integrity depend upon the stress applied to the assembly. The stress is often of thermomechanical or of vibrational nature. ...